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advanced fabrication technologies for ic manufacturing


Posted by:
Created at: Tuesday 30th of October 2012 05:00:02 AM
Last Edited Or Replied at :Tuesday 30th of October 2012 05:00:02 AM
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advanced fabrication technologies for ic manufactu..................[:=> Show Contents <=:]



advanced fabrication technologies for ic manufacturing


Posted by:
Created at: Tuesday 30th of October 2012 05:00:02 AM
Last Edited Or Replied at :Tuesday 30th of October 2012 05:00:02 AM
project on advanced fabrication technologies for ic manufacturing, advanced fabrication technologies for ic manufacturing , advanced fabrication technology for ic manufacturing, advanced fabrication ic manufacturing , advanced fabrication technologies for ic manufacturing pdf, advanced fabrication technologies ic manufacturing , seminar on ic fabrication, fabrication technologies for ic manufacturing , advance fabrication technology for ic manufacturing, advance fabrication technologies for ic manufacturing , advanced febrication technologies for ic manufacturing, advanced fabrication technologies for ic mnaufacturing , advanced technology in ic fabrication,
advanced fabrication technolo..................[:=> Show Contents <=:]



additive manufacturing ppt


Posted by:
Created at: Monday 01st of October 2012 12:25:39 PM
Last Edited Or Replied at :Monday 01st of October 2012 12:25:39 PM
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machines involved and their functioning in additive ..................[:=> Show Contents <=:]



Laser micro fabrication technologies on RF MEMS


Posted by: seminar paper
Created at: Thursday 15th of March 2012 04:18:54 AM
Last Edited Or Replied at :Thursday 15th of March 2012 04:18:54 AM
micro fabrication in mems seminar topic, mems fabrication ,
s on RF MEMS



INTRODUCTION



Radio Frequency Microelectromechanical Systems Switches (RF MEMS)
Lower insertion loss
High isolation
Greater linearity
Lower static power dissipation

RF MEMS Switch Structure


Substrate
Coplanar waveguide(CPW) signal line
Bridge
Electrode plate

Fabrication based on IC wet and dry etching technique


Fabrication Procedure


Oxidation of SiO2 and deposition of SiN on Si substrate
Formation of signal line and ground electrode
SiN/Ta2O5 double dielectric films on sig..................[:=> Show Contents <=:]



3d ic technology


Posted by: cdpoint
Created at: Saturday 09th of July 2011 04:56:20 AM
Last Edited Or Replied at :Saturday 09th of July 2011 04:56:20 AM
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please send..................[:=> Show Contents <=:]



PRINTED CIRCUIT BOARDSCOIL WINDING AND CABLES


Posted by: smart paper boy
Created at: Saturday 09th of July 2011 01:40:03 AM
Last Edited Or Replied at :Saturday 09th of July 2011 01:40:03 AM
printed circuit board coil winding, vasantha electronic manufacturing services , automatic coil winding machine,
biles, Machineries, Railways, Fuel pump wiring harnesses etc..................[:=> Show Contents <=:]



strategy for optimizing manufacturing operations full report


Posted by: project report tiger
Created at: Wednesday 17th of February 2010 03:42:59 AM
Last Edited Or Replied at :Wednesday 17th of February 2010 03:42:59 AM
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s control such as equipment being down in other parts of the operation, material flow problems or incoming material, and supplies that are not available or are of poor quality.
Run speed determines the percentage of time that the equipment ran at maximum speed. Time spent running at actual operating speed is compared with the maximum equipment speed. Run speed efficiency is calculated by determining how the actual amount of material produced compares with what amount of material should have been produced at maximum speed or standard rate.
Yield is the percent of time that quality product is ..................[:=> Show Contents <=:]



3- D ICs


Posted by: Computer Science Clay
Created at: Sunday 01st of March 2009 02:46:01 AM
Last Edited Or Replied at :Sunday 01st of March 2009 02:46:01 AM
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3- D IC's

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wire pitch and increasing die size. Additionally, heterogeneous integrati..................[:=> Show Contents <=:]



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